Silicon interposer
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「Silicon interposer」文章包含有：「晶片兩大巨頭決戰先進封裝技術」、「3DIC矽載板(Siliconinterposer)之製作及組裝製程」、「先進封裝如何更加「先進」？」、「輝達非台積CoWoS鏈聯電搶頭香擴產2倍」、「Interposer」、「Interposers」、「ChipPackagingPart3」、「2DSiliconInterposers」、「HowInterposersAreDesignedandUsedinChipPackaging」
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晶片兩大巨頭決戰先進封裝技術
https://www.applichem.com.tw
有別於「2D」的SiP （System-in-Package），2.5D 封裝在SiP 基板和晶片之間，插入了矽仲介層（Silicon Interposer），透過矽穿孔（TSV，Through-Silicon ...
3D IC矽載板(Silicon interposer)之製作及組裝製程
https://ieknet.iek.org.tw
【內容大綱】. 一、前言; (一)Memory-chip Stacking; (二)Wide I/O Memory; (三)Wide I/O DRAM; (四)Wide I/O Interface; 二、測試載具; 三、TSV/RDL/IPD矽載板製作 ...
先進封裝如何更加「先進」？
https://www.eettaiwan.com
一般的2.5D封裝也就是指將一大片die切成一個個小die (或稱chiplet)，後將這些小die放在仲介層(interposer)上(當然這只是2.5D封裝的某一類方案)。這是在 ...
輝達非台積CoWoS鏈聯電搶頭香擴產2倍
https://www.ctee.com.tw
目前CoWoS擴產的關鍵中，主要是矽中介層（Silicon Interposer）供給不足，未來將由聯電獲得CoWoS中前段CoW部分的矽中介層供貨，而美系封測大廠Amkor及 ...
Interposer
https://en.wikipedia.org
An interposer is an electrical interface routing between one socket or connection to another. The purpose of an interposer is to spread a connection to a ...
Interposers
https://semiengineering.com
While silicon interposers are proven technology, organic interposers are potentially easier to work with because the material is more resilient. No matter which ...
Chip Packaging Part 3
https://www.electronicdesign.c
2D Silicon Interposers
https://www.murata.com
Murata Silicon Interposer main applications · Space transformer, from semiconductor pitch to applicative substrate pitch with layout redistribution and space ...
How Interposers Are Designed and Used in Chip Packaging
https://resources.pcb.cadence.
Because silicon is a semiconductor, it can be used to build active interposers, which will contain devices embedded in the silicon structure. These interposers ...